2022
| Awards |
|---|
| 2023.01.19 |
| 髙桑聖仁, “Low-temperature direct bonding of thin parylene film for the integrated ultrathin electronics”, 日本機械学会, 情報・知能・精密機器部門 ベストプレゼンテーション表彰 |
| 2023.01.19 |
| 髙桑聖仁, “フレキシブルエレクトロニクス同士の集積化接合に向けた薄膜上の金電極同士の直接導電接合技術の開発。接着剤を使わずに水蒸気プラズマ処理による活性化接合を目指した。”, 日本学術振興会, 育志賞 |
| Journals |
|---|
| 2022.09.24 |
| Kewei Song, Yue Cui, Liang Liu, Boyang Chen, Kayo Hirose, Md. Shahiduzzaman & Shinjiro Umezu, “Electro spray deposited TiO2 bilayer flms and their recyclable photocatalytic self cleaning strategy”, Scientific Reports volume 12, Article number: 1582 (2022) https://doi.org/10.1038/s41598-022-05633-w |
| 2022.09.24 |
| Katsuhisa Sakaguchi, Kei Akimoto, Masanori Takaira, Ryu-ichiro Tanaka, Tatsuya Shimizu, and Shinjiro Umezu,” Cell-Based Microfluidic Device Utilizing Cell Sheet Technology”, Cyborg and Bionic Systems Volume 2022, Article ID 9758187 https://doi.org/10.34133/2022/9758187 |
| 2022.09.24 |
| Fan Huang, Kewei Song, Yue Jiang, Kayo Hirose, Shinjiro Umezu, “3D-printed swab with cover for precision diagnosis”, Journal of Materials Science: Materials in Medicine volume 33, Article number: 8 (2022) https://doi.org/10.1007/s10856-021-06635-2. |
| 2022.09.24 |
| Yujiro Kakei, Shumpei Katayama, Shinyoung Lee, Masahito Takakuwa, Kazuya Furusawa, Shinjiro Umezu, Hirotaka Sato, Kenjiro Fukuda and Takao Someya, “Integration of body-mounted ultrasoft organic solar cell on cyborg insects with intact mobility”, npj Flexible Electronics 6:78 (2022) https://doi.org/10.1038/s41528-022-00207-2 |
| International Conferences |
|---|
| 2022.09.06 |
| Kewei Song, Fan Huang, Hirose Kayo, Shinjiro Umezu, DLP 3D-printed Swab with Cover for Precision Diagnosis, MIPE2022, B1-4-05, Nagoya University, JAPAN. |
| 2022.08.28 |
| Masahito Takakuwa, Kenjiro Fukuda, Tomoyuki Yokota, Daishi Inoue, Daisuke Hashizume, Shinjiro Umezu, “Low-temperature direct bonding of thin parylene film for the integrated ultrathin electronics” , MIPE2022, B2-1-03, Nagoya University, JAPAN |
| 2022.05.11 |
| Masahito Takakuwa, Kenjiro Fukuda, Tomoyuki Yokota, Daishi Inoue, Daisuke Hashizume, Shinjiro Umezu, Takao Someya, “Development of the Flexible Conductive Bonding Method Without Any Adhesive forWiring of Soft Robots” , 2022 MRS Spring Meeting & Exhibit, SB02.06.05, Honolulu, America |
| 2022.05.23 |
| Kewei Song, Meng Xiangyi, Shinjiro Umezu, Hirotaka Sato, “Constructing 3D Electronics through Multi-Material 3D Printing for Hybrid Systems” IEEE International Conference on Robotics and Automation, May 23-27, 2022 Philadelphia (PA), USA. |
| Domestic meeting |
|---|
| 2022.09.20 |
| 髙桑聖仁, 井ノ上大嗣, 福田憲二郎, 横田知之, 梅津信二郎, 染谷隆夫, “フレキシブルエレクトロニクスの集積化に向けた柔軟な配線技術”, 応用物理学会秋季学術講演会，2022年9月，20p-C105-4 |
| 2022.09.14 |
| 髙桑聖仁, 井ノ上大嗣, 福田憲二郎, 染谷隆夫, 梅津信二郎, “プラズマ表面処理とスチーム加熱を組合わせたパリレン薄膜の接合”, 日本機械学会2022年度年次大会, 2022年9月, J163-08 |
| 2022.09.06 |
| 孟祥義,Song Kewei,位田 達也,梅津 信二郎,“木材・プラスチック複合材の3Dプリントとその機械的性質の研究”,日本機械学会２０２２年茨城講演会，２０２２年８月 |
| 2022.06.17 |
| 髙桑聖仁, 福田憲二郎, 横田知之, 井ノ上大嗣, 橋爪大輔, 梅津信二郎, 染谷隆夫, “水蒸気プラズマと水を用いた超柔軟基板の接合”, ソフトロボット学の創生第九回領域班会議，2022年6月, No1 |