{"id":669,"date":"2023-01-26T15:27:08","date_gmt":"2023-01-26T06:27:08","guid":{"rendered":"https:\/\/umeshinlab.wordpress.com\/?page_id=669"},"modified":"2023-12-27T07:06:46","modified_gmt":"2023-12-27T07:06:46","slug":"2022-2","status":"publish","type":"page","link":"https:\/\/umeshin.mmech.waseda.ac.jp\/index.php\/2022-2\/","title":{"rendered":"2022"},"content":{"rendered":"\n<h1 class=\"wp-block-heading\">2022<\/h1>\n\n\n\n<figure class=\"wp-block-table is-style-stripes has-small-font-size\"><table class=\"has-background has-fixed-layout\" style=\"background-color:#b3d6b3\"><thead><tr><th>Awards<\/th><\/tr><\/thead><tbody><tr><td>2023.01.19<\/td><\/tr><tr><td>\u9ad9\u6851\u8056\u4ec1, \u201cLow-temperature direct bonding of thin parylene film for the integrated ultrathin electronics\u201d, \u65e5\u672c\u6a5f\u68b0\u5b66\u4f1a, \u60c5\u5831\u30fb\u77e5\u80fd\u30fb\u7cbe\u5bc6\u6a5f\u5668\u90e8\u9580\u3000\u30d9\u30b9\u30c8\u30d7\u30ec\u30bc\u30f3\u30c6\u30fc\u30b7\u30e7\u30f3\u8868\u5f70<\/td><\/tr><tr><td>2023.01.19<\/td><\/tr><tr><td>\u9ad9\u6851\u8056\u4ec1, \u201c\u30d5\u30ec\u30ad\u30b7\u30d6\u30eb\u30a8\u30ec\u30af\u30c8\u30ed\u30cb\u30af\u30b9\u540c\u58eb\u306e\u96c6\u7a4d\u5316\u63a5\u5408\u306b\u5411\u3051\u305f\u8584\u819c\u4e0a\u306e\u91d1\u96fb\u6975\u540c\u58eb\u306e\u76f4\u63a5\u5c0e\u96fb\u63a5\u5408\u6280\u8853\u306e\u958b\u767a\u3002\u63a5\u7740\u5264\u3092\u4f7f\u308f\u305a\u306b\u6c34\u84b8\u6c17\u30d7\u30e9\u30ba\u30de\u51e6\u7406\u306b\u3088\u308b\u6d3b\u6027\u5316\u63a5\u5408\u3092\u76ee\u6307\u3057\u305f\u3002\u201d, \u65e5\u672c\u5b66\u8853\u632f\u8208\u4f1a, \u80b2\u5fd7\u8cde<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<div style=\"height:25px\" aria-hidden=\"true\" class=\"wp-block-spacer\"><\/div>\n\n\n\n<figure class=\"wp-block-table is-style-stripes has-small-font-size\"><table class=\"has-background has-fixed-layout\" style=\"background-color:#b3d6b3\"><thead><tr><th>Journals<\/th><\/tr><\/thead><tbody><tr><td>2022.09.24<\/td><\/tr><tr><td>Kewei Song, Yue Cui, Liang Liu, Boyang Chen, Kayo Hirose, Md. Shahiduzzaman &amp; Shinjiro Umezu, \u201cElectro spray deposited TiO2 bilayer flms and their recyclable photocatalytic self cleaning strategy\u201d, Scientific Reports volume 12, Article number: 1582 (2022) https:\/\/doi.org\/10.1038\/s41598-022-05633-w<\/td><\/tr><tr><td>2022.09.24<\/td><\/tr><tr><td>Katsuhisa Sakaguchi, Kei Akimoto, Masanori Takaira, Ryu-ichiro Tanaka, Tatsuya Shimizu, and Shinjiro Umezu,\u201d Cell-Based Microfluidic Device Utilizing Cell Sheet Technology\u201d, Cyborg and Bionic Systems Volume 2022, Article ID 9758187 https:\/\/doi.org\/10.34133\/2022\/9758187<\/td><\/tr><tr><td>2022.09.24<\/td><\/tr><tr><td>Fan Huang, Kewei Song, Yue Jiang, Kayo Hirose, Shinjiro Umezu, \u201c3D-printed swab with cover for precision diagnosis\u201d, Journal of Materials Science: Materials in Medicine volume 33, Article number: 8 (2022) https:\/\/doi.org\/10.1007\/s10856-021-06635-2.<\/td><\/tr><tr><td>2022.09.24<\/td><\/tr><tr><td>Yujiro Kakei, Shumpei Katayama, Shinyoung Lee, Masahito Takakuwa, Kazuya Furusawa, Shinjiro Umezu, Hirotaka Sato, Kenjiro Fukuda and Takao Someya, \u201cIntegration of body-mounted ultrasoft organic solar cell on cyborg insects with intact mobility\u201d, npj Flexible Electronics 6:78 (2022) https:\/\/doi.org\/10.1038\/s41528-022-00207-2<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<div style=\"height:25px\" aria-hidden=\"true\" class=\"wp-block-spacer\"><\/div>\n\n\n\n<figure class=\"wp-block-table is-style-stripes has-small-font-size\"><table class=\"has-background has-fixed-layout\" style=\"background-color:#b3d6b3\"><thead><tr><th>International Conferences<\/th><\/tr><\/thead><tbody><tr><td>2022.09.06<\/td><\/tr><tr><td>Kewei Song, Fan Huang, Hirose Kayo, Shinjiro Umezu, DLP 3D-printed Swab with Cover for Precision Diagnosis, MIPE2022, B1-4-05, Nagoya University, JAPAN.<\/td><\/tr><tr><td>2022.08.28<\/td><\/tr><tr><td>Masahito Takakuwa, Kenjiro Fukuda, Tomoyuki Yokota, Daishi Inoue, Daisuke Hashizume, Shinjiro Umezu, &#8220;Low-temperature direct bonding of thin parylene film for the integrated ultrathin electronics&#8221; , MIPE2022, B2-1-03, Nagoya University, JAPAN<\/td><\/tr><tr><td>2022.05.11<\/td><\/tr><tr><td>Masahito Takakuwa, Kenjiro Fukuda, Tomoyuki Yokota, Daishi Inoue, Daisuke Hashizume, Shinjiro Umezu, Takao Someya, &#8220;Development of the Flexible Conductive Bonding Method Without Any Adhesive forWiring of Soft Robots&#8221; , 2022 MRS Spring Meeting &amp; Exhibit, SB02.06.05, Honolulu, America<\/td><\/tr><tr><td>2022.05.23<\/td><\/tr><tr><td>Kewei Song, Meng Xiangyi, Shinjiro Umezu, Hirotaka Sato, \u201cConstructing 3D Electronics through Multi-Material 3D Printing for Hybrid Systems\u201d IEEE International Conference on Robotics and Automation, May 23-27, 2022 Philadelphia (PA), USA.<\/td><\/tr><\/tbody><\/table><\/figure>\n\n\n\n<div style=\"height:25px\" aria-hidden=\"true\" class=\"wp-block-spacer\"><\/div>\n\n\n\n<figure class=\"wp-block-table is-style-stripes has-small-font-size\"><table class=\"has-background has-fixed-layout\" style=\"background-color:#b3d6b3\"><thead><tr><th>Domestic meeting<\/th><\/tr><\/thead><tbody><tr><td>2022.09.20<\/td><\/tr><tr><td>\u9ad9\u6851\u8056\u4ec1, \u4e95\u30ce\u4e0a\u5927\u55e3, \u798f\u7530\u61b2\u4e8c\u90ce, \u6a2a\u7530\u77e5\u4e4b, \u6885\u6d25\u4fe1\u4e8c\u90ce, \u67d3\u8c37\u9686\u592b, \u201c\u30d5\u30ec\u30ad\u30b7\u30d6\u30eb\u30a8\u30ec\u30af\u30c8\u30ed\u30cb\u30af\u30b9\u306e\u96c6\u7a4d\u5316\u306b\u5411\u3051\u305f\u67d4\u8edf\u306a\u914d\u7dda\u6280\u8853\u201d, \u5fdc\u7528\u7269\u7406\u5b66\u4f1a\u79cb\u5b63\u5b66\u8853\u8b1b\u6f14\u4f1a\uff0c2022\u5e749\u6708\uff0c20p-C105-4<\/td><\/tr><tr><td>2022.09.14<\/td><\/tr><tr><td>\u9ad9\u6851\u8056\u4ec1, \u4e95\u30ce\u4e0a\u5927\u55e3, \u798f\u7530\u61b2\u4e8c\u90ce, \u67d3\u8c37\u9686\u592b, \u6885\u6d25\u4fe1\u4e8c\u90ce, \u201c\u30d7\u30e9\u30ba\u30de\u8868\u9762\u51e6\u7406\u3068\u30b9\u30c1\u30fc\u30e0\u52a0\u71b1\u3092\u7d44\u5408\u308f\u305b\u305f\u30d1\u30ea\u30ec\u30f3\u8584\u819c\u306e\u63a5\u5408\u201d, \u65e5\u672c\u6a5f\u68b0\u5b66\u4f1a2022\u5e74\u5ea6\u5e74\u6b21\u5927\u4f1a, 2022\u5e749\u6708, J163-08<\/td><\/tr><tr><td>2022.09.06<\/td><\/tr><tr><td>\u5b5f\u7965\u7fa9,Song Kewei,\u4f4d\u7530\u3000\u9054\u4e5f,\u6885\u6d25\u3000\u4fe1\u4e8c\u90ce,\u201c\u6728\u6750\u30fb\u30d7\u30e9\u30b9\u30c1\u30c3\u30af\u8907\u5408\u6750\u306e3D\u30d7\u30ea\u30f3\u30c8\u3068\u305d\u306e\u6a5f\u68b0\u7684\u6027\u8cea\u306e\u7814\u7a76\u201d,\u65e5\u672c\u6a5f\u68b0\u5b66\u4f1a\uff12\uff10\uff12\uff12\u5e74\u8328\u57ce\u8b1b\u6f14\u4f1a\uff0c\uff12\uff10\uff12\uff12\u5e74\uff18\u6708<\/td><\/tr><tr><td>2022.06.17<\/td><\/tr><tr><td>\u9ad9\u6851\u8056\u4ec1, \u798f\u7530\u61b2\u4e8c\u90ce, \u6a2a\u7530\u77e5\u4e4b, \u4e95\u30ce\u4e0a\u5927\u55e3, \u6a4b\u722a\u5927\u8f14, \u6885\u6d25\u4fe1\u4e8c\u90ce, \u67d3\u8c37\u9686\u592b, \u201c\u6c34\u84b8\u6c17\u30d7\u30e9\u30ba\u30de\u3068\u6c34\u3092\u7528\u3044\u305f\u8d85\u67d4\u8edf\u57fa\u677f\u306e\u63a5\u5408\u201d, \u30bd\u30d5\u30c8\u30ed\u30dc\u30c3\u30c8\u5b66\u306e\u5275\u751f\u7b2c\u4e5d\u56de\u9818\u57df\u73ed\u4f1a\u8b70\uff0c2022\u5e746\u6708, No1<\/td><\/tr><\/tbody><\/table><\/figure>\n","protected":false},"excerpt":{"rendered":"<p>2022 Awards 2023.01.19 \u9ad9\u6851\u8056\u4ec1, \u201cLow-temperature direct bonding of thin parylene film for the integrated ultrathin electronics\u201d, \u65e5\u672c\u6a5f\u68b0\u5b66\u4f1a, \u60c5\u5831\u30fb\u77e5\u80fd\u30fb\u7cbe\u5bc6\u6a5f\u5668\u90e8\u9580\u3000\u30d9\u30b9\u30c8\u30d7\u30ec\u30bc\u30f3\u30c6\u30fc\u30b7\u30e7\u30f3\u8868\u5f70 2023.01.19 \u9ad9\u6851\u8056\u4ec1, \u201c\u30d5\u30ec\u30ad\u30b7\u30d6\u30eb\u30a8\u30ec\u30af\u30c8\u30ed\u30cb\u30af\u30b9\u540c\u58eb\u306e\u96c6\u7a4d\u5316\u63a5\u5408\u306b\u5411\u3051\u305f\u8584\u819c\u4e0a\u306e\u91d1\u96fb\u6975\u540c\u58eb\u306e\u76f4\u63a5\u5c0e\u96fb\u63a5\u5408\u6280\u8853\u306e\u958b\u767a\u3002\u63a5\u7740\u5264\u3092\u4f7f\u308f\u305a\u306b\u6c34\u84b8\u6c17\u30d7\u30e9\u30ba\u30de\u51e6\u7406\u306b\u3088\u308b\u6d3b\u6027\u5316\u63a5\u5408\u3092\u76ee\u6307\u3057\u305f\u3002\u201d, \u65e5\u672c\u5b66\u8853\u632f\u8208\u4f1a, \u80b2\u5fd7\u8cde Journals 2022.09.24 Kewei Song, Yue Cui, Liang Liu, Boyang Chen, Kayo Hirose, Md. Shahiduzzaman &amp; Shinjiro Umezu, \u201cElectro spray deposited TiO2 bilayer flms and their recyclable photocatalytic self cleaning strategy\u201d, Scientific Reports [&hellip;]<\/p>\n","protected":false},"author":2,"featured_media":0,"parent":0,"menu_order":0,"comment_status":"closed","ping_status":"closed","template":"","meta":{"footnotes":""},"class_list":["post-669","page","type-page","status-publish","hentry"],"_links":{"self":[{"href":"https:\/\/umeshin.mmech.waseda.ac.jp\/index.php\/wp-json\/wp\/v2\/pages\/669","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/umeshin.mmech.waseda.ac.jp\/index.php\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/umeshin.mmech.waseda.ac.jp\/index.php\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/umeshin.mmech.waseda.ac.jp\/index.php\/wp-json\/wp\/v2\/users\/2"}],"replies":[{"embeddable":true,"href":"https:\/\/umeshin.mmech.waseda.ac.jp\/index.php\/wp-json\/wp\/v2\/comments?post=669"}],"version-history":[{"count":1,"href":"https:\/\/umeshin.mmech.waseda.ac.jp\/index.php\/wp-json\/wp\/v2\/pages\/669\/revisions"}],"predecessor-version":[{"id":1159,"href":"https:\/\/umeshin.mmech.waseda.ac.jp\/index.php\/wp-json\/wp\/v2\/pages\/669\/revisions\/1159"}],"wp:attachment":[{"href":"https:\/\/umeshin.mmech.waseda.ac.jp\/index.php\/wp-json\/wp\/v2\/media?parent=669"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}